Xu Y. Hybrid photonic assemblies based on 3D-printed coupling structures 2023

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Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).
Preface
Introduction
Theoretical and technological background
Hybrid external-cavity lasers
Optical packaging using 3D-printed facet-attached microlenses
Superconducting nanowire single-photon detector with 3D-printed free-form microlenses
Summary and Outlook
Appendices
A Hybrid external-cavity lasers
B Optical packaging using 3D-printed facet-attached microlenses
C Superconducting nanowire single-photon detector with 3D-printed free-form microlenses